JPS6231497B2 - - Google Patents

Info

Publication number
JPS6231497B2
JPS6231497B2 JP54168118A JP16811879A JPS6231497B2 JP S6231497 B2 JPS6231497 B2 JP S6231497B2 JP 54168118 A JP54168118 A JP 54168118A JP 16811879 A JP16811879 A JP 16811879A JP S6231497 B2 JPS6231497 B2 JP S6231497B2
Authority
JP
Japan
Prior art keywords
frame
external terminal
lead frame
lead
internal leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54168118A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5691455A (en
Inventor
Akihiro Kubota
Tsuyoshi Aoki
Rikio Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16811879A priority Critical patent/JPS5691455A/ja
Publication of JPS5691455A publication Critical patent/JPS5691455A/ja
Publication of JPS6231497B2 publication Critical patent/JPS6231497B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49534—Multi-layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP16811879A 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device Granted JPS5691455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16811879A JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16811879A JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5691455A JPS5691455A (en) 1981-07-24
JPS6231497B2 true JPS6231497B2 (en]) 1987-07-08

Family

ID=15862176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16811879A Granted JPS5691455A (en) 1979-12-26 1979-12-26 Lead frame for manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5691455A (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4706105A (en) * 1983-02-02 1987-11-10 Hitachi, Ltd. Semiconductor device and method of producing the same
JPH0519958Y2 (en]) * 1985-08-20 1993-05-25
US4800419A (en) * 1987-01-28 1989-01-24 Lsi Logic Corporation Support assembly for integrated circuits
JP2515032B2 (ja) * 1990-04-18 1996-07-10 株式会社東芝 半導体装置用リ―ドフレ―ム
JP6577373B2 (ja) * 2016-01-18 2019-09-18 新光電気工業株式会社 リードフレーム及びその製造方法、半導体装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50147668A (en]) * 1974-05-16 1975-11-26
JPS589585B2 (ja) * 1974-10-04 1983-02-22 日本電気株式会社 デンシブヒンヨウリ−ドフレ−ム

Also Published As

Publication number Publication date
JPS5691455A (en) 1981-07-24

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